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Powder dispersant
Application Background

    With the miniaturization and increasing integration of electronic products, thermal management has become increasingly important. Inorganic powders with excellent thermal conductivity have become essential components in heat dissipation interfaces for electronic products. For example, in the field of semiconductor device packaging, spherical silica powder, alumina powder, and aluminum nitride powder are widely used due to their high thermal conductivity, good filling properties, high fluidity, low wear, and low stress levels. However, since most inorganic powders are polar or highly polar hydrophilic materials, while organic polymers have non-polar, hydrophobic surfaces, the compatibility between them is very poor. This makes it difficult for inorganic powders to be uniformly dispersed within organic matrices. If these powders are directly added to organic matrices, the resulting composite materials may have low powder fill rates, reduced mechanical properties, and issues related to thermal aging. Therefore, surface modification of inorganic powders is necessary before application.

    As an innovative silicone manufacturer, Trancy has developed a series of high-quality composite materials—powder dispersants. These dispersants utilize the active groups or electrical properties on the powder surface to combine with long-chain alkyl polymers (surface modifiers), creating a dense siloxane layer on the surface of the inorganic powders. This transformation from hydrophilic to hydrophobic surfaces improves the wettability of the powder particles and enhances their compatibility with organic media, allowing them to disperse easily in water or organic compounds.

Product Overview:

    This product is a long-chain alkyl-functional silane that effectively bonds inorganic materials such as metals, metal oxides, glass, and silica with organic thermosetting resins. It forms a superior hydrophobic coating on the inorganic materials, improving their compatibility with organic polymers and allowing for higher filling rates. Additionally, it enhances adhesion and bonding properties, thereby strengthening the mechanical strength of the resulting products. For these reasons, it is widely used as a surface treatment agent for inorganic powders, fillers, fibers, leather, and building materials.

Product features

Low viscosity

Increase fill rate

Good viscosity reduction effect

Thermal aging stability

Scene Application
Primarily used for processing inorganic materials such as alumina, boron nitride, aluminum hydroxide, SiC, silica, glass, kaolin, ceramics, mica, talc powder, etc.
Widely apply 5G communication, new energy vehicles, intelligent terminals, cameras, etc.
Can be used to improve waterproofing in fibers, leather, building materials, etc.

Get in touch

If you wish to learn more about the product information, please feel free to contact us. Product Manager: Mr. Yu 177 2766 2733 (mobile phone and WeChat are the same number)